VU Boekhandel

Solder Joint Reliability Prediction for Multiple Environments

Hoofdkenmerken

Auteur:	Perkins, Andrew E.;
Titel:	Solder Joint Reliability Prediction for Multiple Environments
Uitgever:	Springer-Verlag New York Inc.
ISBN:	9780387793931
ISBN boekversie:	9780387793948
Editie:	2009 ed.
Land van oorsprong:	United States
Prijs:	€ 146.40
Verschijningsdatum:	23-10-2008
Bericht:	Langere levertijd (2-3 weken)

Inhoudelijke kenmerken

Leesniveau:	Professional & Vocational
Categorie:	Electronics engineering
Geillustreerd:	37 Tables, black and white; 70 Illustrations, black and white; XVI, 192 p. 70 illus.
Dewey code:	621.381

Technische kenmerken

Verschijningsvorm:	Hardback
Paginas:	192
Hoogte mm.:	235
Breedte mm.:	155
Gewicht gr.:	489

Inhoud:

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.